CUS NTF NO. 43/1997 DATE 07/05/1997
Duty Concession extended to several items
In exercise of the powers conferred by sub-section (1) of section 25 of the Customs Act, 1962 (52 of 1962), the Central Government, being satisfied that it is necessary in the public interest so to do, hereby makes the following further amendments in the notification of the Government of India in the Ministry of Finance (Department of Revenue) No. 13/97 - Customs dated the 1st March, namely : -
In the Table below the said notification,-
(1) In List A,-
(i) against S.No. 18 for the entry in column (2), the entry "32, 35, 39" shall be substituted;
(ii) against S.No. 63, for the entry in column (3), the entry "Solder plated / unplated brass strips upto 100 mm width; Silver plated brass strips upto 100 mm width" shall be substituted;
(iii) after S.No. 85 and the entries relating thereto, the following shall be inserted, namely,-
| (1) | (2) | (3) | (4) |
|---|
| 86 | 39 | Plain polystyrene film dielectric capacitors. | Plain film capacitors, mixed. |
| 87 | 72, 73 | Nickel Iron Cobalt Alloy in all forms | Semiconductor decides; electronic valves and tubes; transistor headers; glass to metal seals; lead frames; cast alloy permanent magnets; hybrid microcircuit; gas discharge tubes. |
| 88 | 69, 85 | (i) Ceramic plates /flats cases / bases / formers
(ii) Steatite rods and bars in coated or uncoated form parts. | Resistor s (other than heating resistors); semiconductor devices; hybrid microcircuits; electron guns and electron gun |
| 89 | 72 | Coated / uncoated electrogalvanised CRCA / mild stainless steel in the form of sheet / strip/ wire / coils. | DC Micromotors; tape deck mechanism. |
| 90 | 25, 28, 70, 84, 85 | strontium carbonate; garnet powder; stud pins; litharge | Glass shells / parts for colour picture tubes. |
| 91. | 28, 29,32, 39, 48, 69, 74, 85 | Ceramic bodies (coated or uncoated); bandoliering tape with or without adhesives; Solder plated copper wire of dia upto 1 mm; solder plated brass wire of dia. upto 1 mm; high melting point solder alloy; paper backed polyurethane tape; epoxy marking ink with or without hardner / thinner | Thermistors. |
| 92. | 74 | in coated / solder plated copper wire | Resistors. |
| 93. | 28, 38, 39, 70, 74, 76, | Aluminium paste; ethylene vinyl acetate sheets (EVA); primer for EVA; Crane glass; tedlar coated aluminium sheet; phosphorous oxychloride; halo carbon (CF4) / Freon gas; tinned copper interconnect; toughened glass with low iron content and transmittivity of min. 90% and above; multilayered sheets with tedlar base; fluro polymer resin; ultra high purity (UHP) silane in UHP nitrogen; UHP silane; MOCVD grade phosphine in UHP silane; silver sputtering target; high purity tin tetrachloride; nitrogen trifluoride of 99% purity and above | Solar cells / modules |
(2) in List B, S.No. 1 and the entries relating thereto shall be omitted and S.Nos. 2 to 9 shall be renumbered as S.Nos. 1 to 8 respectively.
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