S.No. |
Chapter or Heading or Sub-heading or tariff item [OLD Chapter] |
Description of imported goods |
Description of finished goods |
(1) |
(2) |
(3) |
(4) |
LIST A |
1. |
15,29,32, 34,39,48, 70 |
Alpha cellulose paper/cotton paper; Electrical grade kraft paper; Tung oil; Volan/Silane treated glass fabric/cloth |
Copper clad laminates phenolic or paper phenolic or glass ep-oxy types; composite type copper clad laminates; printed circuit boards. |
2. |
25,28,40, 56,70,84, 85 |
Potassium Carbonate/Potassium Nitrate (prilled); Barium carbonate; Pumice powder; Cerium oxide; Anode buttons; Necks and Neck tubings; woolfelt/ rubber based felt sleeve; cullet (recycled glass scrap); [OLD- Wool felt ] Spodumene |
Parts of television picture tubes; parts of cathode ray tubes
[OLD- Glass shell/parts of television picture tube.] |
(In col.3 bold words has been substituted vide Cus Ntf No.26/2002 Dt.1/03/2002) |
3. |
25,28,40, 70, 84, 85 |
Strontium carbonate; garnet powder; stud pins; Titanium dioxide; sodium antimonate; rubber sleeve |
Class shells/parts for colour picture tubes. Glass shell/ parts of cathode ray tubes |
4. |
|
Omitted |
|
5. |
28 |
High purity gases : Argon; halocarbon-14; halocarbon-116; halocar-bon-23; helium; silicon tetra-chloride; sulphur hexafluoride; chlorine; silane; hydrochloric acid; phosphine & silane mixture; boron trichloride; dichlorosilane; diborane; hydrogen bromide; phosphine in nitrogen; nitrous oxide; boron trifluoride; arsine & arsine mixture; phosphine in hydrogen; hydrogen; nitrogen |
Integrated circuits, Semi- conductor devices. |
6. |
28,29 |
High purity chemicals: Acetic acid MOS/CMOS grade; Sulphuric acid MOS/ CMOS grade; Hydrochloric acid MOS/CMOS grade; Buffered oxide etchant MOS/ CMOS grade; Ammonium fluoride MOS/CMOS • grade; Trichloro-ethylene MOS/ CMOS grade; Isopropyi alcohol MOS/CMOS grade; Acetone MOS/CMOS grade; Hydrofluoric acid MOS/ CMOS grade; Nitric acid MOS/CMOS grade; Phos-phoric acid MOS/CMOS grade; Hydrogen peroxide MOS/ CMOS grade |
Integrated circuits, Semi-conductor devices. |
7. |
28,29,38, 76 |
Cadmium sulphide; cadmium telluride; silicon dioxide; cadmium chloride; zinc telluride; indium; germane; disilane; phosphine; hydrogen fluoride; aluminium sputtering target; zinc oxide sputtering target, adhesive coated aluminium foil; high purity hydrogen high purity nitrogen; high purity argon; copper doped graphite paste; high purity methane; diborane in high purity helium |
Solar cells/modules. |
8. |
28,29,32 38,39,68 74 ., |
Copper plating salts, their i, brighteners, levellers, condi tioners, replenishers, stabi lizers; Black Oxide Coating (Microtech) solution/ salts, predip solution/salts, palladium catalyst solution/ salts |
Printed Circuit Boards. |
9. |
28,29,32 38,71 |
Resistive, Conductive, Di-electric, Overglaze or solder pastes, compositions or inks in packing not exceeding 20 kg. |
Hybrid Microcircuits; Potentiometers; Resistors (other than heating resistors); Ceramic and Mica Capacitors; Conductive Rubber Switches/Key Boards. |
10. |
28,29,32,39,48,69,74,85 |
Ceramic bodies (coated or uncoated); bandoliering tape with or without adhesives; solder plated copper wire of dia. upto 1 mm; solder plated brass wire of dia. upto 1 mm; high melting point solder alloy; paper backed polyurethane tape; epoxy marking ink with or without hardner/thinner |
Thermistors. Ceramic capacitors; Resistors (other than heating resistors) |
11. |
28,29,34 |
Resist stripper |
Semi-conductor devices, printed circuit boards. |
12. |
28,29,34,85 |
Special materials: Surfactant, tetra ethyl-ortho-silicate (TEOS); trimethyl borate (TMB); trimethyl phosphite (TMPI); trichloroethane (TCA); dichloroethylene; sputtering targets; photo resist primer; edge bead remover |
Integrated circuits, Semi-conductor devices. |
13. |
28,29,37 |
Photo resist & associated thinners or/and developers; photospin glass |
Semi-conductor devices, printed circuit boards. LED/LED Displays, Liquid Crystal Displays, Hybrid Micro-Circuits |
14. |
28,29,38 |
Electrolyte |
Etched or Formed Aluminium Foil, Electrolytic Capacitors. |
15. |
28, 29,38 |
Dopants or doping sources in all forms, and with or without precious metal constituents |
Semi-conductor devices. |
16. |
28,29,38,39 |
Epoxy/Epoxide resins/ Epoxy moulding powder, compounds or encapsulants; Fillers, thinners, hardeners, accelerators and fire retardants |
Capacitors; Semi-conductor Devices; Light Emitting Diodes; mounted piezo electric crystal; Liquid Crystal Displays; Electronic Valves and Tubes; Switches; Copper clad laminates of glass epoxy/paper expoxy type; composite type copper clad laminates; Delay lines; Line and Wave Traps; Potentiometers; Silicon Crystals or Silicon wafers; Connectors; Resistors (other than heating resistors); Deflection parts; Loudspeakers; Magnetic Heads; Paper Cones/ Spiders/Dust Caps for Loudspeaker; Hybrid Microcircuits; Printed parts. Relays
(In S. No.16, in column (4) bold words has been substituted vide CUS NTF NO. 28/2003 DATE 01/03/2003) |
17. |
28, 32 |
Ferric Oxide of purity of 99% and above; manganous manganic oxide with manganese content 71% or above; Manganese di-oxide of purity of 99% and above, Manganous Oxide; Nickel Oxide; Strontium Carbonate
(In S. No.17, in column (3) bold words has been substituted vide CUS NTF NO. 28/2003 DATE 01/03/2003) |
Ferrites. Ceramic capacitors, Resistors (other than heating resistors) |
18. |
28,38,39,70, 74,76 |
Aluminium paste; ethylene vinyl acetate sheets (EVA); primer for EVA; Crane glass; tedlar coated aluminium sheet; phosphorous oxychloride; halo carbon (CF4)/Freon gas; tinned copper interconnect; toughened glass with low iron content and transmittivity of min. 90% and above; multilayered sheets with tedlar base; fluro polymer resin; ultra high purity (UHP) silane in UHP nitrogen; UHP silane; diborane in UHP silane; MOCVD grade phosphine in UHP silane; silver sputtering target; high purity tin tetrachloride; nitrogen trifluoride of 99% purity and above |
Solar cells/modules. |
19. |
28,39, 68,73 |
Blue steel lapping carriers/lapping carriers; lapping vehicles; lapping abrasive powder; lapping compound |
Mounted piezoelectric crystals; Printed Circuit Boards; Semi-conductor devices; Potentiometers; Resistors (other than heating resistors); Connectors; Switches; Relays; Tape deck mechanism; Magnetic heads; Deflection parts; DC micromotor upto 13.5 V not exceeding 20 Watt rating; Silicon in all forms, LED lamps and displays. |
20. |
28,29, 81,85 |
Tantalum powder; Tantalum wire; CM Seals; Cans; Silver powder suspension; Manganese Nitrate; Heat shrinkable polyester tubing |
Tantalum capacitors. Mounted Piezo Electric Crystals |
21. |
28,48,69,75,78,81,84 |
Lead based ceramic composition; Magnesium titanate based ceramic composition; Neodium based ceramic composition; Alumina setters/slabs; Lint free paper/paper towels/filter paper; Zirconia milling media/high alumina tumbling media; Steel shots - copper plated hollow; Nickel and sulphonic acid based plating chemicals; Razer blades/doctor blades |
Ceramic dielectric (multilayer) capacitors. Ceramic capacitors, Resistors (other than heating resistors) |
22. |
28, 68 |
Tantalum Neodyme oxide; Neodyme oxide; Strontium carbonate |
Ceramic Capacitors. |
23. |
28,70,73,75, 85 |
Crystal Holders; Bases; covers; Glass Bulbs; Glass Bases; Nickel Eyelets; Springs; Solder wire 25 SWG or thinner; Chromium Pellets |
Mounted Piezoelectric crystals. |
24. |
28, 81 |
Tungsten rhenium wire; Suspension of aluminium oxide in binder; Suspension of tungsten powder and aluminium oxide in binder; Triple carbonate suspension of calcium, barium, strontium in binder |
Electron guns and electron gun parts. |
25. |
29 |
Tetra Bromo Bisphenol-A; Tricresyl/Aryl Phosphate |
Copper clad laminates for Printed Circuit Boards. |
26. |
32 |
Electron Phosphor |
Electronic Valves and Tubes |
27. |
28, 32, 38 [OLD 32] |
Desmearing agents |
Printed Circuit Boards. |
28 |
32,35,39 |
Silicone based resins, oils, varnishes, lacquers, elastomers, with or without additives |
Semi-conductor Devices; Liquid Crystal Displays; Electronic Valves and Tubes; Resistors (other than heating resistors); Connectors; Magnetic Tape; Relays; Potentiometers; Switches; Capacitor grade metallised plastic film; Piezoelectric crystal; Hybrid Micro circuits. Capacitors |
29. |
32,37, 39 |
Solder Mask/Resist in ink or film form, with or without associated catalysts |
Printed Circuit Boards. |
30. |
32,38 |
Screen printing inks, dyes, emulsions, lacquers, films (including sensitisers, hardners, catalysts) |
Semi-conductor devices, printed circuit boards, potentiometers, capacitors, hybrid microcircuits, printed parts, coils and inductors, resistors (other than heating resistors). |
31. |
32, 38 |
internal dag, aqua dag, graphite, hitasols, external quoting graphite or external dag
(In S. No.31, column (3) has been substituted vide CUS NTF NO. 28/2003 DATE 01/03/2003) |
Electronic Valves and Tubes. |
32. |
35, 39 |
Polyamide coatings or adhesives |
Semi-conductor devices; Heat sinks; deflectioii parts. |
33 |
37 |
Photo Polymer Film |
Printed Circuit Boards; Liquid Crystal Displays. |
34 |
37, 39 |
High resolution, high contrast photographic films and photo stencil films; DIAZO (C6H5N2) films |
Printed Circuit Boards; semi-conductor devices; hybrid microcircuits. |
35. |
37, 70 |
High Resolution Photo Plates; Photomask Substrates |
High Resolution Photo Masks; Semi-conductor devices; Liquid Crystal Displays; Silicon Single Crystals or Wafers. Printed Circuit Boards |
36. |
37, 70 |
High resolution photo mask |
Semi-conductor devices; Printed Circuit Boards; Liquid Crystal Displays. |
37. |
38 |
Silicon in the form of undiffused wafers, discs or chips |
Semi-conductor devices. |
38. |
38,39,76 or Any other Chapter [OLD38,39,76] |
Polyvinyl flouride (TEDLAR); Tedlar Aluminium Tedlar; Toughened Glass; Silver paste [OLDAluminium Tedlar] |
Solar cells/modules. |
(Sr.No.38 has been subsitutted vide CUS NTF NO.14/2011 DATE 01/03/2011) |
39. |
38, 81 |
Lithium niobate wafers |
Hybrid microcircuits. |
40. |
38, 85 |
Silicon in the form of diffused wafers, discs or chips (with or without molybdenum disc) |
Hybrid microcircuits or semi-conductor devices. |
41. |
38, 85 |
Getters |
Electronic valves and tubes. |
42. |
39 |
Glass epoxy or/and polyamide prepregs |
Multilayer Printed Circuit Boards; copper clad laminates. |
43. |
39 |
Silicone rubber |
Keypad switches; parts of EHT transformers. |
44. |
39 |
Plain plastic films (other than polystyrene film) of thickness 26 microns or below, metallised plastic films of thickness 26 microns or below
Explanation.- For the removal of doubts,‘Plain Plastic Film’ includes biaxially oriented poly propelene (BOPP) film
[OLDPlastic Film Capacitors or Mixed Dielectric Capacitors, other than Power Capacitors.
Explanation.- for the removal of doubts, “plain plastic film” includes bi-axially oriented polypropylene (BOPP) film]
(In S. No.44 Explanation has been inserted vide CUS NTF NO. 28/2003 DATE 01/03/2003) |
Plastic Film Capacitors; Mixed Dielectric Capacitors. |
45. |
39 |
Nylon 6.30% glass filled, flame retardant moulding powder/granules and with or without other additives |
Potentiometers; connectors. Parts of relays/switches/connectors |
46. |
39 |
Plain and glass filled nylon/polyamide with or without other additives |
Relays; Potentiometers; tape deck mechanism; connectors. Parts of connectors; parts of relays/switches/connectors |
47. |
39 |
Polypropylene moulding powder / granules |
Deflection parts; Cassettes. Capacitors |
48. |
39 |
Polybutylene terephthalate |
Connectors; deflection parts; switches; relays. resistors; potentiometers; parts of relays/switches/connectors |
49. |
39 |
Heat shrinkable PVC sleeving, tubing, film or ring |
Capacitors; relays; deflection parts. |
50. |
39 |
Polyurethane lapping pads |
Mounted piezoelectric crystals; Printed Circuit Boards/semi-conductors devices; potentiometers; resistors (other than heating resistors); connectors; switches; relays; tape deck mechanisms; magnetic heads; deflection parts; DC Micromotors upto 13.5 volts and not exceeding 20 watts rating silicon (in all forms). |
51. |
39 |
Plain polystyrene film |
Plain film capacitors; mixed dielectric capacitors. |
52. |
39 |
Plain plastic film (other than Polystyrene film) of thickness 12 microns or below
"Explanation.- For the removal of doubt, "plan plastic film" includes Biaxially Oriented Polypropylene (BOPP) film; |
Electronic capacitor grade metallised dielectric plastic film. |
53. |
39 |
Release film for multilayer laminates |
Printed Circuit Boards. |
54. |
39, 40 |
Polyvinyl Alcohol, Polyisobutylene, Chlorosulphonated/ chlorinated polyethylene [OLD- Chlorosulphona ted Polyethylene (HYPALON) ] |
Ferrites. |
55. |
39, 43 |
Antistatic materials in the form of tubes, strips, mats, covers, bins, boxes, containers Semi-conductor devices. Hybrid microcircuits. |
56. |
39,48,59, 85 |
Insulating/taping material (including pocket carrier tape) in tape, roll or strip form with or without adhesive |
Capacitors; deflection parts; resistors (other than heating resistors); semi-conductor devices; inductors. |
57. |
39,48,85 |
Domes or Dust caps; Paper/Plastic cones |
Loudspeakers. |
58. |
39,48,85 |
Parts of Potentiometers |
Potentiometers. |
59. |
39, 59, 73 |
Screen mesh of stainless steel/polyester/metallised polyester/metallised nylon (in sizes of mesh 60 or above) |
Ceramic capacitors. resistors; potentiometers; hybrid microcircuits |
60. |
39, 69,73,85 |
Ceramic/alumina substrates |
Potentiometers; printed parts. resistors (other than heating resistors) |
61. |
39, 73, 79,85 |
Parts of magnetic sound heads |
Magnetic sound heads. |
62. |
39, 74,76 |
Copper clad laminates laminated to nylon, teflon, polyester; Aluminium clad entry foil and back up laminates |
Printed Circuit Boards. |
63. |
39,85 |
Polyethylene terephthalate film with ferro magnetic coating of thickness upto 0.005 inch with magnetic coating 50 to 180 microinch |
Floppy diskettes. |
63A. |
39,73 |
Moulded shell with liner, Steel hub ring, spring, shutter |
Floppy diskette (3.5" size). |
64. |
39,85 |
Parts/articles of silicone, Elastomer or Silicone rubber |
Liquid Crystal Displays; Semi-conductor Devices; EHT Transformers; Potentiometers; Electrolytic Capacitors; Solid tantalum capacitors. |
65. |
39,85 |
Formers, bases, bobbins; Holders, brackets; Shielding cases,cans |
RF/IF coils or transformers or deflection parts. |
66. |
40,59 |
Bungs; Rubber pinch rollers with or without plastic bush |
Electrolytic capacitors; tape deck mechanisms. |
67 |
40, 84,85 |
Parts of Rotor Assembly; Commutator assembly or parts thereof; Brush assembly or parts thereof |
DC Micromotors upto 13.5 volts and not exceeding 20 watts rating. |
68. |
40, 85 |
Anode assembly consisting of EHT cable, silicone rubber cap and contact spring or parts thereof (EHT cable in cut pieces or running length) |
Deflection parts. |
69. |
48 |
Electrolytic Capacitor/Condenser Tissue paper |
Electrolytic Capacitors; Plastic Film Capacitors. |
70. |
48,76 |
Kraft paper/tissue paper or aluminium foil for voice coil |
Loud-speakers (cone type). |
71 |
59 |
Felt sheet (fully compressed) of 1.5 mm thickness and below |
Tape deck mechanism. |
72. |
69, 78,85 |
Headers; Caps with or without leads; Cans with or without leads; Pins; Stud seals; Lead beads; Ceramic beads; Ceramic-glass packages; Cap to Lead Assembles; Ceramic Pipes; Lead frames, single or in roll form; Housings; Brass ring |
Semi-conductor devices; Light Emitting Diodes; Resistors (other than heating resistors); Capacitors; Connectors; Hybrid Microcircuits; Printed parts. |
73. |
69, 85 |
Alumina rods and bars (with Alumina content above 90%) in coated or uncoated form; Ceramic plates/flats/cases/ bases/formers; Steatite rods and bars in coated or uncoated form |
Resistors (other than heating resistors); Semi-conductor Devices; Hybrid Microcircuits; Electron Guns and Electron Gun parts. |
74. |
69,85 |
Ceramic dielectric (coated or uncoated) |
Ceramic capacitors. |
75. |
70 |
Glass filament yam |
Silane treated glass cloth/fabric for use in the copper clad laminates. |
76. |
32,70,85 |
Glass frit or glass powder; Glass preforms or pellets; Glass tubes |
Liquid Crystal Displays; semi-conductor devices; Electronic valves and tubes (other than television picture tubes/cathode ray tubes); Glass to metal seals; Lead frames; Transistor headers; Reed relays or Reed switches; delay lines; resistors (other than heating resistors); mounted piezoelectric crystals; electron guns and electron gun parts; gas discharge tubes. |
77. |
70, 85 |
Fused Quartzware |
Semi-conductor devices; silicon in all forms. |
78. |
71 |
Synthetic quartz crystal blocks and blanks |
Mounted Piezoelectric crystals. |
[Omitted79] |
71 or 7220 12 90 or 7409 11 00 or 7409 90 00(OLD71) |
Contact tape with pure Nickel base and Crown Gold alloy; Contact tape with solder Diamond Back in fine silver; Contact tape in silver or silver alloy with or without palladium with Gold overlay Silver bronze strips/ coils; Copper strips/coils/sheets; Copper nickel alloy or other alloys of copper in strip/coil/sheets; Stainless steel strips |
Relays; Switches. |
(In Sr.No.79 In Column 2 & 3 has been subsituted & inserted vide CUS NTF NO. 20/2010 DATE 27/02/2010)
|
80. |
71 |
Gold in the form of wire, ribbon, preform of purity 99.99 % and above |
Semi-conductor devices; Light Editing Diodes. |
81. |
71, 72, 75,80 |
Nickel plated steel strip; tin silver antimony alloy |
Semi-conductor devices. |
82. |
71, 76, 85 |
Aluminium wire with silicon or magnesium impurity of upto 2%; gold wire with phosphorous or antimony doping |
Semi-conductor devices. |
83. |
72 |
CRNGO silicon steel strip /sheet/coil/hoop with or without tin plating |
DC Micromotor; Potentiometer; Resistors. |
84. |
72 |
Coated/uncoated electro-galvanised CRCA/ mild steel/ stainless steel in the form of sheet / strip /wire/coils |
DC Micromotor; tape deck mechanism. resistors, potentiometers |
85. |
72,73 |
Iron of 99.7% purity and above |
Cast Alloy Permanent Magnets. Relays |
86. |
72, 73, 75,81 |
Nickel Iron Cobalt Alloy in all forms |
Semi-conductor devices; electronic valves and tubes; transistor headers; glass to metal seals/lead frames; cast alloy permanent magnets; hybrid microcircuits; gas discharge tubes. |
87. |
72 or 73 |
Copper clad tin coated steel wire, dia 0.4 mm to 1.2 mm/ solder plated Copper cover steel wire (SPC). |
Lead tabs for electrolytic capacitors. Capacitors |
88. |
73,85 |
Metal clad substrates in any form with or without tags |
Potentiometers; Hybrid microcircuits; Printed parts; semi-conductor devices; Light Emitting Diodes. |
89. |
74 |
Electrolytic Tough Pitch (ETP) Copper wire rods |
Lead wire for electronic parts. |
90 |
74 |
Solder plated/unplated brass-strips upto 100 mm width; silver plated brass strips upto 100 mm width |
Potentiometers/parts of potentiometers; connectors/parts of connectors; switches/parts of switches; relays/parts of relays.
(Col.4 has been substituted vide Cus Ntf No.57/2002 date 31/05/2002)
[OLD Potentiometers; connectors; switches; relays.] |
[Omitted91] |
74 |
Phosphor Bronze Sheets/ bars/ section/ flats/ strips/wire/rods/foils/ pipes, with or without plating |
Relays/parts of relays; Tape Deck Mechanism; connectors/parts of connectors; potentiometers/parts of potentiometers; Heat Sinks; cassettes; parts of cassettes; T.V.Tuner; telescopic antenna; gas discharge tubes/parts of gas discharge tubes. Switches; parts of switches
(Col.4 has been substituted vide Cus Ntf No.57/2002 date 31/05/2002)
[OLD Relays; Tape Deck Mechanism; Connectors; Potentio-meters; Heat Sinks; cassettes; parts of cassettes; T.V. tuner; telescopic antenna; Gas discharge tubes.] |
92. |
74 |
Beryllium Copper rods/strips/sheets/wire/ foils, with or without plating ; Rectangular Profile Brass material(CuZn39Pb2) |
Connectors/parts of connectors; relays/parts of relays; switches/parts of switches; gas discharge tubes/parts of gas discharge tubes.
(Col.4 has been substituted vide Cus Ntf No.57/2002 date 31/05/2002)
[OLD Connectors; Relays; Switches; gas discharge tubes.] |
(In col.3 bold words has been substituted vide Cus Ntf No.26/2002 Dt.1/03/2002) |
93. |
74 |
Tin coated/solder plated copper wire |
Resistors. Capacitors, Deflection Components, Thermistors, Varistors sub-miniature fuses, micro fuses, resettable fuses and thermal fuses |
94. |
74 |
Continuous cast copper rod/ copper scrap [OLD - Continuous cast copper wire rod/copper scrap, electrolytic grade of purity 99.9% or above ] |
Copper foil for copper clad laminates. |
(In col.3 bold words has been substituted vide Cus Ntf No.26/2002 Dt.1/03/2002) |
95. |
74,76, 85 |
Copper-cadmium braided wire/Self-soldering/self-bonding aluminium wire |
Loudspeakers; microphones. |
96. |
74,85 |
Oxygen-free high conductivity (OFHC) Copper base with weldable steel ring |
Semi-conductor devices. |
[Omitted97] |
74,85 |
OFHC copper wires, bars, rods, angles, shapes and sections, plates, sheets, strips, tubes and pipes |
Semi-conductor devices; electronic valves and tubes; transistor headers; glass to metal seals; capacitors. |
98. |
74,85 |
Rayon or Silk cover Litz wire of the following sizes -(a) 6, 8, 12 and 24 strands with each strand diameter 0.03 mm; (b) 6 or 9 strands with each strand diameter 0.04 mm |
RF/IF Coils or transformers. |
99. |
74,85 |
Parts made of OFHC copper |
Semi-conductor devices, electronic valves & tubes, transistor headers, glass to metal seals, capacitors. |
100. |
76 |
Etched or formed Aluminium Foils |
Electrolytic Capacitors. |
101. |
76 |
Plain Aluminium foil containing more than 99% Aluminium |
Etched or formed Aluminium foil; electrolytic capacitors or plastic film capacitors. |
102. |
76 |
Aluminium of purity 99% or above in the form of wire, strips, sheets, rods, bars, pipes, plates, sections, ribbons or shapes |
Cans or Leads for Electrolytic Capacitors; Semi-conductor Devices; Light Emitting diodes; Capacitors; Capacitor grade Metallised Plastic films; Potentiometers; Disc covers for electrolytic capacitors. |
103. |
81 |
Cobalt |
Cast Alloy Permanent Magne ts. |
104. |
81 |
High purity chromium powder (99.99% and above) |
Semi-conductor devices, Mounted piezo electric crystals, electronic valves and tubes, vacuum interrupter tubes. Resistors |
105. |
81,85 |
Molybdenum and molybdenum alloys, wrought, in all forms and articles and parts thereof |
Electronic Valves and Tubes; X-ray tubes; Semi-conductor Devices; Mounted Piezoelectric Crystals. |
106. |
84,85 |
Parts of Vacuum Interrupter Tubes |
Vacuum Interrupter Tubes. |
107. |
85 |
Self bonding/Self soldering insulated or enamelled copper wire |
Deflection parts; Loudspeakers; Relays; Magnetic Heads; RF/IF Coils; Transformers (other than Power transformers); DC Micromotors upto 13.5 volts and not exceeding 20 watts rating; electronic tuner. Reed Relays, Hybrid Micro-circuits, Degaussing Coil |
(In col.3 bold words has been substituted vide Cus Ntf No.26/2002 Dt.1/03/2002) |
108. |
85 |
Parts of gas discharge tubes |
Gas discharge tubes. |
109. |
85 |
Light Emitting Diodes in the form of Chips, wafers or undiced discs |
Light Emitting. Diodes; Lamps and Displays. |
110. |
85 |
Parts of Cathode Ray Tubes (other, than Glass parts) |
Cathode Ray Tubes. |
111. |
85 |
Lead Tabs/Paddle Tabs |
Electrolytic Capacitors. |
112. |
39,72,74,76,85[OLD39, 74, 76, 85 [OLD- 85 ] |
Parts of Relays, Switches, Connectors |
Relays; Switches; Connectors. |
113. |
85 |
Parts of electron Guns |
Electron Guns, Television picture tubes or Cathode Ray Tubes. |
114. |
85 |
Casings of aluminium |
Electrolytic capacitors. |
115. |
85 |
Parts of CD/VCD/DVD mechanisms, namely, optical pick up assembly and parts thereof, DC micro motors, Loader parts of plastic (parts of CD loader), cable connector, springs, screws washer
[OLD- Parts of CD-Deck Mechanism ] |
CD Deck Mechanism. |
116. |
85 |
Parts of Fly-back Transformer |
Flyback Transformers. |
117. |
85 |
Parts of Tuners |
TV Tuners. |
118. |
85 |
Parts of Data Cartridge |
Data Cartridge. |
119. |
85 |
Parts of transmitting tubes |
Transmitting tubes. |
120. |
85 |
Parts of deflection yoke (DY), [OMITTED - excluding colour deflection yoke core ] |
Deflection parts. |
121. |
OMITTED
(S.No.121 has been omitted vide CUS NTF NO. 28/2003 DATE 01/03/2003) |
[OLD 121. |
75,85, 90 |
Nickel and nickel alloys, wrought in all forms and articles thereof |
Semi-conductor Devices; Liquid Crystal Displays; Electronic valves and tubes; Pick-up cartridges; Stylii; X-Ray Tubes; Cast Alloy Permanent magnets; Transistor Headers; Glass to metal seals; Lead frames; Resistors (other than heating resistors); Magnetic Heads; Potentiometers; Electron guns and electron gun parts; Electro-magnetic shields; Encoders and synchros.] |
122 |
39,74,75,76 |
Composite copper clad materials consisting of Paper + Epoxy + Glass cloth |
Printed Circuit Boards |
123 |
74 |
Glass Epoxy Copper clad laminates or Paper Phenolic Copper clad laminates |
Printed Circuit Boards |
124 |
74 |
Copper foils(plain or adhesive coated) |
Copper clad laminates (phenolic or glass epoxy types);composite type copper clad laminates; multi-layer Printed Circuit Boards Parts of connectors |
125 |
28,29,38,72, 74,84 |
Cupric Chloride Etchant; Ammonical Etchants; Solid Carbide Drills; Routers; Hot Air Levelling Flux; Electroless Copper Plating Solution; Sensitisers; Activators; Post Activators; Copper foil of refined copper; Colloidal / Semi colloidal Graphite (Shadow) |
Printed Circuit Boards |
126 |
28,29,39,68,71,81,82 |
Plastic Film for Wafer Dicing; Graphite Jigs /Block/ Rods /Plates; Dicing blades/ wheels; Tungsten filament and or parts thereof;
Tungsten Wire / Rod; Colour Paste and Diffusants; Silver conductive paste / Suspension; Palladium Wire; n- Butyl Acetate; Bonding Tools
(In Col.3 bold words has been substituted vide Cus Ntf No.57/2002 date 31/05/2002)
[OLD |
LED/LED Displays; Semiconductor Devices; Hybrid Microcircuits; Mounted Piezo Electric Crystals; Resistors; Potentiometers |
127 |
70,85 |
Parts of data graphic display tubes(colour), with a phosphor dot screen pitch smaller than 0.4mm |
Data graphic display tubes(colour), with a phosphor dot screen pitch smaller than 0.4mm |
128 |
70,75 |
Glass Tubes/ Insulators/ Spacers;
(S.No.128 column (3) has been substituted vide CUS NTF NO. 28/2003 DATE 01/03/2003) |
Mounted piezo electric crystals |
129 |
39 |
Diallylphthalate(DAP) Moulding Powder or Compound (Plain or Glass/Fibre filled with or without additives)
(Col.3 has been substituted vide Cus Ntf No.57/2002 date 31/05/2002)
[OLD Diallylphthalate (DAP) Moulding Powder or Compound; Plain or Glass/ Fibre filled with or without additives] |
Connectors; Switches with contact rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC; Potentiometers; Relays of contact rating upto 7 amperes; Resistors |
130 |
39 |
Polyvinyl Chloride Film/Sheet |
Floppy Disks/Diskettes |
131 |
28,38,39 |
Gold plating make up and replenisher solutions and salts; Resins for gold recovery |
Semiconductor devices; LED/LED Displays; Connectors; PCBs Parts of connectors |
132 |
74 |
Solder Plated Annealed Copper Wire (SCA) of diameter 0.4 mm to 1.2 mm
[OLD Solder Plated Annealed Copper Wire (SCA) of diameter 0.4mm to 1mm] |
Plastic film capacitors |
133 |
79,80 |
Zinc of purity 99% or above in rod, wire or Strip form (plated or unplated); Zinc wire/ Zinc-Aluminium wire with dia upto 5 mm; Tin- Zinc wire with dia upto 3mm
[old-Zinc of purity 99% or above in Rod, Wire or Strip form; Zinc Wire / Zinc- Aluminum wire with dia up to 5mm ; Tin - zinc wire with dia upto 3mm]
|
Electronic Capacitor Grade Metallised Plastic Film / capacitors; blade fuses 1 to 40 Amps [old-Capacitors] |
134 |
80 |
Tin Foil/ Tin Alloy Foil |
Plastic Film Capacitors; Resistors (other than heating resistors) |
135 |
76 |
Aluminium wire (of purity 99.9% or above ) of dia upto 3mm |
Lead Wires/Lead Tabs for electrolytic capacitors; Electronic Capacitor grade Metallized Plastic film; Plastic film capacitors; semiconductor devices Capacitors |
136 |
28 |
Barium Carbonate |
Ceramic Capacitors |
137 |
38,39,69 |
Hydroxy Propyl Methyl Cellulose Barium Titanate based or Lead Titanatebased Ceramic composition/ Powder |
Ceramic Capacitors, Ceramic Substrates /Rods/ Discs / Dielectric |
138 |
28 |
Magnesium Oxide (Purity not less than 98%); Zinc Oxide (Purity not less than 98%); Aluminium Oxide (Purity not less than 99.9%); Vanadium Pentoxide (Purity not less than 99.9%); Lithium Carbonate (Purity not less than 99%); Manganese Carbonate (Purity not less than 98%); Bismuth Oxide (Purity not less than 99%); Cobalt Oxide (Purity not less than 99%); Copper Carbonate (Purity not less than 98%); Chromium Oxide (Purity not less than 98%); Indium Oxide (Purity not less than 99%); Dysprosium oxide (Purity not less than 99%); Gadolinium Oxide (Purity not less than 99%);Yttrium Oxide (Purity not less than 99.9%); Calcium Carbonate (Purity not less than 98%) ; Tin Oxide (Purity not less than 98%); Magnesium Carbonate Purity not less than 99%); Iron Oxide (Purity not less than 99%); Barium Carbonate (Purity not less than 99%)
(S.No.138 column (3) has been substituted vide CUS NTF NO. 28/2003 DATE 01/03/2003) |
Resistors; Ceramic Capacitors |
139 |
39,48,59 |
Resin -VAGH Co-Polymerised Vinyl Chloride Vinyl Acetate, Pressure Sensitive felt, with or without adhesive,Silicon Coated/ Carbonized silicon paper |
Magnetic Tapes/Cassettes Parts of cassettes |
140 |
39 |
Polyimide Film (Kapton) |
IC Sockets (Connectors); Resistors; Potentiometers; Semiconductor devices |
141 |
39 |
Modified Polyphenylene Oxide |
Deflection Components ; potentiometers |
142 |
39 |
Phenolic Moulding Powder/ Resin |
Resistors; Potentiometers; Capacitors; Hybrid Micro-circuits |
143 |
72,74 |
Lead wires of Iron or non alloy steel plated or coated with other base metals |
Resistors ; Potentiometers; Plastic Film Capacitors; Lead Tabs of Electrolytic Capacitors
(In Col.4 bold words has been substituted vide Cus Ntf No.57/2002 date 31/05/2002) |
144 |
29,72,74,76, 85 |
Copper alloy resistance wire and strips; Steel or Aluminium in substrate or sheet form; Butyl DiGol |
Resistors; Potentiometers |
145 |
69,75,76,81 |
Metal alloy targets |
Resistors; Resistor Grade Metallized Ceramic Cores |
146 |
85 |
Chip Transistors; Varicap Diodes |
Tuners; Modulators; Hybrid Micro Circuits |
[Omitted147] |
74 |
Cladded Copper/ Copper Alloy Strip / Foil |
Switches with contact rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC; Connectors DC Micro-motors; parts of connectors |
148 |
28 |
Zinc Oxide (Purity minimum 99.5%);Strontium Oxide/ Strontium Carbonate; Zinc Stearate (Purity minimum 99%); Polyvinyl alcohol (PVA); Polyvinyl Butyral (Ash Content max 1%) |
Pre-Calcined Ferrite Powder (Spray Dried); Resistors |
149 |
28 |
Zirconium Oxide (Purity not less than 99%); Tin Oxide (Purity not less than 99%); Lanthanam Oxide (Purity not less than 99%); Zinc Oxide (Purity not less than 98%); Polystyrene (Purity not less than 98%); Magnesium Oxide (Purity not less than 98%); Calcium Carbonate (Purity not less than 98%); Tantalum Oxide (Purity not less than 99%); Barium Carb onate (Purity not less than 99%) |
Microwave Dielectrics; Ceramic Capacitors; Resistors ; Varistors; Thermistors |
150 |
39 |
Phenolic Moulding Powder /Resin |
Hybrid Micro circuits; Potentiometers; Ceramic Capacitors; Thermistors; Varistors; Switches with contact rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC; Connectors Capacitors |
151 |
39,69 |
Guide Ceramic; Guide LCP (Liquid Crystal Polymer) |
Print heads |
152 |
85 |
Parts of Loudspeaker |
Loudspeakers |
153 |
74,85 |
High Voltage Rectifier Diodes; Focus Potmeter; Electrolytic Tough Pitch Wire/Rods/Formed Pins/parts made thereof |
Deflection Components |
154 |
39 |
Polycarbonate (Plain or glass filled moulding powder) |
Resistors; Potentiometers; Switches with contact rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC Capacitors |
155 |
39 |
Poly Vinyl Acetate |
Resistors; Potentiometers; Hybrid Micro Circuits |
156 |
72 |
Nickel Iron (low carbon / gas free grade) in Sheet or strip form / EB Welded Triple Metal Strips./ Controlled Expansion Alloy Strips |
Resistors; Potentiometers ; |
157 |
39 |
SRBP (Synthetic resin bonded paper) sheets and substrate
(S. No.157 column (3) has been substituted vide CUS NTF NO. 28/2003 DATE 01/03/2003) |
Potentiometers; Switches with contact rating les than 5 amperes at voltage not exceeding 250 Volts AC or DC |
158 |
25 |
Ball Clay |
Ceramic Cores /Substrates for resistors |
159 |
32 |
Borosilicate Glass Powder |
Parts of Electron Gun /Multiform Bead Glass Rods |
[Omitted160] |
74 |
Unplated Brass Strips in Coil form 70 mm width; Phosphor Bronze Strips in Coil Form |
Connectors |
[Omitted161] |
72,74 |
Bimetal sheets in coil forms/ piece parts; Copper clad steel sheets in coil forms / piece parts |
Relays of contact rating upto 7 amperes |
162 |
28,29 |
Ammonium Dihydrogen Phosphate ; Ammonium pantaborate |
Electrolytic Capacitors |
163 |
38 |
Carbon / Flurographite Powder |
Potentiometers |
164 |
28,34 |
Boron Nitride Suspension ; Metallisation Inhabitation Fluid (Oil) |
Electronic Capacitor Grade metallised Plastic Film/ Plastic Film Capacitors |
165 |
29 |
Dowanol PX-16S (Non- CFC solvent) |
Flyback Transformers / Focus Resistors |
166 |
28,29,38,48 |
Monoalkylethers of ethylene glycol.; Flux 1544 ;Ammonium Hydroxide (CMOS Grade); Ammonia (NH3) (CMOS Grade); Lid perform; Chemcassette |
Semiconductor devices |
167 |
76 |
Etched Aluminium Foil |
Formed Aluminium Foil for electrolytic capacitors. |
(Sl.No.122 to 167 has been inserted vide Cus Ntf No.26/2002 Dt.1/03/2002) |
(1) |
(2) |
(3) |
(4) |
168 |
29,32, 38,39, 71 |
Dibutyl ether/Di-nbutyl ether Solvent; DMH Solvent; Printing Inks; Protective U.V.Lacquer; Dyes; Optical grade polycarbonate; Methyl Lactate; OFP; Cake Box; BOPP Film; Jewel box; Silver Sputtering Target |
CD-R (unrecorded CD) |
(Sl.No.168 has been substituted vide Cus Ntf No.08/2003 Date 13/01/2003) |
[OLD 168 |
28, 39 |
Dyes; Optical grade polycarbonate; Jewel box |
CD-R (unrecorded CD)] |
(Sl.No.168 has been inserted vide Cus Ntf No.108/2002 Date 10/10/2002) |
169 |
76 |
Aluminium clad entry foil |
Printed circuit board |
170. |
28 |
Phosphoric acid (MOS/CMOS, electronic grade);Hydrogen peroxide (MOS/CMOS, electronic grade) |
Semi-conductor devices, LED/LED displays |
171. |
74, 76, 80 |
Aluminium wire with silicon or magnesium with impurity upto 2%;
Bonding wire (aluminum, gold and copper based ) |
Semi-conductor devices, LED/LED displays, Hybrid micro-circuits |
172. |
80 |
Tin silver antimony alloy in any form |
Semi-conductor devices, LED/LED displays |
173. |
28 |
Titanium dioxide of minimum purity 99% |
Potentiometers, ceramic capacitors |
174. |
28, 29, 35, 72, 81 |
Barium bromide; Sodium aluminate ; Barium aluminate; Methoklone; Methyl chloride; Dichloro methane; Titanium metal powder (99% purity); Cesium glass powder; Barium glass powder; Argon –Neon mixed gas (99% purity); Argon-hydrogen mixed gas (99% purity); Copper Plied Steel wire (tin plated ) with dia upto 1.5 mm;Adhesive paste |
Gas discharge tubes |
175. |
39 |
Tedlar film |
Printed circuit boards, semiconductor devices, multi layer laminates, glass epoxy copper clad laminates |
176. |
39 |
Polyester film |
Magnetic tape, plastic film capacitors |
177. |
29, 39 |
MEK (Methyl Ethyl Ketone); Polyurethane /Urethane elastomer;Cyclohexanone |
Magnetic tape |
178. |
39 |
Polyolefin heat shrinkable tubes/ sleeves |
Deflection components |
179. |
27, 39, 75, 85 |
Kilopoise Grease; Polyester mesh; Nickel alloys resistance wires and strips in bare or enameled form; |
Resistors and Potentiometers |
180. |
85 |
Buffered Oxide Echants |
Semi-conductor devices, LED/LED displays |
181. |
39 |
Conductive silver epoxy and hardener |
Mounted Piezoelectric crystals,Hybrid microcircuits |
182. |
39 |
Noryl; Nylon |
LED/LED Displays, switches, power entry connectors |
183. |
39 |
Polyacetal |
LED/LED displays, switches |
184. |
39 |
HDPE; LDPE; Poly propylene |
LED/LED displays |
185. |
75, 85 |
Stem pin |
Electron gun, electronic valves and tubes, parts of electron gun |
186. |
39 |
Silicon oil |
Capacitors, resistors, electronic capacitor grade metallised plastic film/ plastic film capacitors |
187. |
27 |
Microcrystalline wax |
Plastic film capacitors |
188. |
72 |
Coated/ uncoated CRCA/ Mild stainless steel in the form of sheets/ strips/ coils |
Switches, lead frames |
189. |
69, 73 |
Conveying trays/super refractories/ pusher tiles/ ceramic saggers; Grinding steel balls (hardness 58-60%, carbon minimum 0.15%, chromium 1-1.2%);Steel balls |
Soft ferrite parts/ pre-calcined ferrite powder (spray dried), capacitors, resistors |
190. |
69,70,71,74,85 |
Silver Copper Alloy wires; Glass tubes of sizes between 2 mm to 6mm outside diameter, in cut lengths upto40mm; Brass Fuse Caps; Polymeric Positive Temperature Coefficient Chips; Ceramic Tubes; Blade Fuse Body [OLD Silver copper alloy wires;Glass tubes of sizes between 4mm and 6mm outside diameter, in cut lengths upto 40mm; Brass fuse caps; PPTC chips; Ceramic tubes] |
Glass cartridges fuses/ ceramic tube fuses/PPTC resettable fuses, blade fuses 1 to 40 Amps sub-miniature fuses, micro fuses, resettable fuses and thermal fuses [OLD PPTC resettable fuses] |
191. |
28, 29, 38 |
Silicon carbide roller for furnace; polyethylene glycol; Zucoplast; Polyamonium citrate; Octanol; Copper oxide |
Soft ferrites parts/ pre-calcinated ferrite powder (spray dried) |
192. |
68 |
Grinding wheels (metal bond, resin bond, diamond wheel, Conc 50-100%, grit D15-D30-400 mesh)/slicing wheels |
Soft ferrites parts/ pre-calcined ferrite powder (spray dried), semiconductor devices |
193. |
25, 28, 40, 69, 73, 85 |
High speed spindles of more than 10,000 RPM; silicon carbide hollow heating rods, with or without perforations; Heating coils (made of kanthal wire suitable for 13750 C dia 1 mm ); Cobalt oxide (99% pure); Conveying trays (335 X 340 X 30 mm Alumina / cumulite); Setting batts (320X320X15 mm alumina / cumulite);Alumina sandwiched silicon carbide plate (340X170X15 mm alumina / cumulite); Magnesium oxide; Cupric oxide; Miraflow-A (polycarbon acid); Chloropolyethylene (CPE); Temperature measuring rings |
Ferrites |
194. |
69, 85 |
Piezo ceramic formulated material / powder; Piezo ceramic discs/ mounted piezo electric plates; diaphragm of permalloy; weight of permalloy; terminal pins; yoke |
Buzzers/ sirens /ringers |
195. |
73 |
Needle and springs |
Print head |
196. |
72, 85 |
T-yoke |
Loudspeakers |
197. |
28, 39 |
Acetylene black carbon/ other carbon and carbon powders; PTFE powder solutions |
Resistors and potentiometers |
198. |
39, 74, 85 |
Former, bases, bobbins, brackets; CP wires; P.B.T.; Phenol resin moulding powder;Lamination/ El silicon steel strips |
Transformers |
199. |
39 |
Polybutylene terephthalate |
Connectors |
200. |
29 |
Ammonium adipate;Azelaic acid;P.Nitro benzoic acid |
Electrolytic capacitors |
201. |
71 |
Pelladium copper contact tapes |
Relays |
202. |
34, 72 |
Polywax; Tin coated CRCA sheets |
Tuners |
203. |
85 |
Parts of remote control |
Remote control |
204. |
85 |
Diffusion elements |
Semiconductor devices |
205. |
71 |
Silver copper alloy wire in dia upto 0.25 mm |
Metal to ceramic brazing rings for GD tubes |
206. |
38, 39, 40, 68, 74, 85 |
Ceramic disc single layer; pin; washer; axial lead finish; solder/ solder paste/ solder with paste/ solder flux; solder with flux; wire leads; eyelet finish; eyelet fixing collect; marking ink; epoxy resin/ stycast; carrier tape/ cover tape/ taping material/ sealing tape/ plastic reels |
EMI/RFI filters |
207. |
34 |
Termination paste |
Capacitors, EMI/RFI filters |
208. |
39 |
Phenolic resins; epoxy phenolic resins; silicon adhesive agent |
Capacitors, resistors |
209. |
73 |
Rivets |
Potentiometers |
210. |
69, 75, 85 |
Parts of cathodes |
Cathodes for electron guns |
211. |
72 |
Soft magnetic iron strips |
Relays |
212. |
79 |
Zinc manganate |
Soft ferrites |
213. |
39 |
Polypropylene granules |
Capacitors |
214. |
38 |
Catalysts |
Resistors |
215. |
74 |
Bronze powder |
Resistors |
216. |
38 |
Bentone |
Resistors |
217. |
25 |
Quartz powder |
Resistors |
218. |
32 |
Pigments |
Capacitors, resistors |
219. |
28 |
Magnesium aluminum silicate |
Resistors |
220. |
59 |
Fabric coated with rubber;Wax emulsion; basoplast |
Loudspeakers, paper cones/ spiders/ dust caps for loudspeakers |
221. |
39, 40, 84 |
Polyacetals, Acrylonitrile-Butadiene-Styrene(ABS) copolymers; polystyrene; Rubber belts /ring upto 150 mm; Acetal plastic powder/ resin /granule; Capstan shafts, sintered bush, rubber belts |
CD /DVD mechanism, loudspeakers |
222. |
28, 39, 40, 70 |
Polyester/polystyrene latex, glass cloth tape, acry emulsion,cobalt blue |
Cathode ray tubes |
223. |
69, 72, 75, 85 |
Stainless steel wire of dia below 0.8 mm; Stainless steel strips of thickness below 0.6mm; ceramic bases; eyelets; sleeves; caps; nails |
Parts of electron guns |
224. |
72, 73, 75,76, 81 |
CRCA sheets, strips, wire and coils whether galvanized or not; Stainless Steel 304/310/316/420 grades in the form of sheets, strips, wire, coils; Trimetal steel/ INVAR in the form of sheets, strips, wire or coils; Alcoat (aluminised steel sheets) in the form of sheets, strips, wire or coils; Incoloy strips |
Parts of cathode ray tubes |
“225. |
2834 9019 |
(i) Palladium Tetra Amine Sulphate |
Connectors |
3824 9090 |
(ii) Palladium make up solution |
3824 9090 |
(iii) Palladium Additive(OLD(iii) Palladium Addotove) |
3824 9090 |
(iv) Palladium replenisher |
9010 9000 |
(v) Palladium Anode Polariser |
3908 9090 |
(vi) Liquid crystal polymer (LCP) |
|
3824 90 21 |
(vii) Palladium electroplating salt |
|
(In Sr.No.225 has been inserted & subsituded vide CUS NTF NO. 20/2010 DATE 27/02/2010) |
226. |
3921 1900 |
(i) SRPB strips/sheets & substrate |
Relays |
7419 9990 |
(ii) Braided copper wire |
74 |
(iii) Copper nickel Alloy with layer of palladium Copper with or without an intermediate layer of cooper in strips/ coil form. |
227. |
2513 2090 |
(i) Pumice powder |
Cathode ray tubes |
3209 9090 |
(ii) No bake emulsion |
3402 9099 |
(iii) Cleaner for No Bake Lacquer |
5911 9090 |
(iv) Acetate tape |
228. |
7226 9990 |
(i) Alloy 223 |
Parts of CRT |
7220 9090 |
(ii) SS 631 |
229. |
8544 19 |
(i) Enamelled Aluminium wire |
Loudspeaker, Degaussing coils |
230. |
27, 29, 32, 38, 39, 40, 68, 69, 70, 73, 81, 82, 85, 90 |
(i) Solderon Tin concentrate
(ii) Solderon Acid HC
(iii) Solderon ST-300
(iv) Solderon strip
(v) Satin 108
(vi) Marking ink
(vii) Melamine mould cleaning compound
(viii) Tungsten boats and baskets
(ix) Quartz wool tweezers
(x) Teflon wafer carriers
(xi) Diamond tips
(xii) Dressing plates
(xiii) Capillary
(xiv) Rubber tip
(xv) Push up needles
(xvi) Thermocouples
(xvii) Cartridge heaters |
Semiconductors |
231. |
2710 1960 |
(i) Hydroisomerized base oil |
Cable Filling/ Flooding compounds (Thixotropic jelly) for optical fibre cables |
3902 9000 |
(ii) Polyalphaolefin |
3902 3000 |
(iii) Thermoplastic elastomer |
3824 9011 |
(iv) Organoclay gellant |
232. |
33, 39,69, 76 |
(i) Perfluoro Polyether Oil (Fomblin oil)
(ii) Ceramic evaporation boats
(iii) Graphic foil |
Electronic Capacitor grade metallised Plastic film for Capacitors |
233. |
7011 90 |
(i) ITO coated top glass plate |
Plasma display panel/module |
7011 90 |
(ii) Bottom glass plate (High strain point) |
7011 20 |
(iii) Exhaust tube |
7011 20 |
(iv) Preform ring |
7011 20 |
(v) Glass/film filter for PDP |
3824 90 |
(vi) Bus electrode paste |
3824 90 |
(vii) Transparent dielectric paste/powder |
3824 90 |
(viii) White dielectric paste/powder |
3824 90 |
(ix) Barrier rib paste/powder |
3824 90 |
(x) Vehicle for frit paste |
3206 49 |
(xi) Phosphor paste/powder |
3920 99 |
(xii) Dry film resist for barrier rib |
3920 99 |
(xiii) Dry film resist for ITO |
3920 99 |
(xiv) Laminated TD |
3920 99 |
(xv) Lapping tape |
2820 90 |
(xvi) MgO evaporation material |
3207 40 |
(xvii) Sealing frit paste |
3214 90 |
(xviii) Sealing frit powder |
6804 22 |
(xix) SS powder for sandblasting |
8443 90 |
(xx) Screen printing mask |
8443 90 |
(xxi) Photo mask |
7020 00 |
(xxii) Neoceram setter plate |
8529 90 |
(xxiii) TCP (Tape carrier package) |
6815 10 |
(xxiv) Graphite sheet |
234. |
3824 90 |
(i) Sebacic acid |
Aluminium electrolytic capacitors” |
3824 90 |
(ii) Ammonium para nitro benzoate |
3824 90 |
(iii) Adipic aid |
3824 90 |
(iv) Glutaric acid |
3824 90 |
(v) Ammonium benzoate |
3505 20 |
(vi) PVA powder |
3824 90 |
(vii) Triethanolamine |
3824 90 |
(viii) Ortho nitro anisol |
3824 90 |
(ix) Para nitro phenol |
3824 90 |
(x) Methoxy phenol |
|
2528 90 10 |
(xi) Boric acid |
|
|
2905 31 00 |
(xii) Mono ethylene glycol |
|
|
3212 10 00 |
(xiii) Marking foil/ stamping foil |
|
|
27122090; 382490 [old-2712 20 90 |
(xiv) Liquid paraffin
(xv) Para nitro benzyl alcohol
|
|
235 |
3907 99 20
3404 90 33
3908 90 90 |
(i) Plastic powder PBT (Poly brominated Terephthalate)
(ii) PCT (Poly chlorinated terphenyls)
(iii) Stanyl |
IC sockets |
236 |
85469090 |
Polyster insulation tapes |
Degaussing coil and other wound components |
237 |
7605 or 854419 |
Aluminium wire of purity 99.9% or more of dia upto 3 mm; Copper clad Aluminium wire of purity 99.9% or more of dia upto 3 mm |
Deflection Yokes for Colour Picture Tubes |
Sr.Nos 236 & 237 has been added vide CUS NTF NO.14/2011 DATE 01/03/2011) |
(In Table Sr.No.234 amended & 235 has been added vide CUS NTF NO. 20/2010 DATE 27/02/2010) |
(In the table the word of col.(2) has been substituted & S.Nos. 225 to 234 has been inserted vide CUS NTF NO. 25/2008 DATE 01/03/2008)
(S.Nos. 27, 44, 62, 112, 132, 133, 145, 168, 190, 200, 222, 224 has been substituted vide CUS NTF NO. 22/2005 DATE 01/03/2005) |
LIST B |
1. |
28 |
Litharge |
Glass shells/parts for colour picture tubes. parts of cathode ray tubes |
2. |
28 |
Gamma Ferric Oxide |
Magnetic Inks or Magnetic Tape. |
3. |
38 |
Precalcined / Pre-sintered ferrite powder |
Ferrites |
4. |
58,69,84, 85 |
Molybdenum Silidde/ Molybdenum disilicide heating elements; conveying trays; saggers |
Ferrites Capacitors; Resistor |
5. |
OMITTED |
6. |
OMITTED |
7. |
OMITTED |
(Sl.Nos.5,6 & 7 has been omitted vide Cus Ntf No.26/2002 Dt.1/03/2002) |
[OLD 5. |
39,74,75, 76 |
Composite copper clad materials consisting of paper + Epoxy + Glass cloth |
Printed Circuit Boards |
OLD 6. |
74 |
Glass Epoxy Copper clad laminates or Paper Phenolic Copper clad laminates |
Printed Circuit Boards |
OLD 7. |
74 |
Copper foils (plain or adhesive coated) |
Copper clad laminates (phenolic or glass epoxy types); composite type copper clad laminates; multi-layer Printed Circuit Boards.] |
(LIST C OMITTED) |
[OLD LIST C |
1. |
|
Omitted |
|
2. |
Omitted |
3. |
Omitted |
4. |
Omitted |
5. |
70 |
TV Glass bulbs/shells; CRT Glass Bulbs/shells; Magnetron Glass bulbs/shells |
Television picture tubes. Cathode Ray tubes or magnetrons. |
6. |
70 |
Glass parts for colour picture tubes (excluding neck or reneck tubes) |
Colour picture tubes. |
7. |
70 |
Parts of TV/CRT Glass bulbs/shells including panels, funnels. Glass tubes (excluding neck or reneck tubes) |
TV Glass bulbs/shells for TV picture tube or CRT Glass bulbs/shells for CRT. |
8 |
70 |
Neck or reneck tubes |
CRT Glass bulbs/shells for CRT. |
9. |
|
Omitted |
|
10. |
Omitted] |